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      RF Hardware Design Engineer Interview

      Oct 8, 2021
      Anonymous interview candidate
      No offer
      Positive experience
      Difficult interview

      Application

      I interviewed at Apple

      Interview

      3 rounds - 2 telephonic interviews and 1 panel interview with 5 people. the whole process was done within 3 weeks. results were announced in 2-3 days. the interviews were back to back in panel interviews

      Interview questions [1]

      Question 1

      Q: how will we setup a lineup? What are disadvantages if we use Filter as first stage. Q: What is EVM? Q: Scenario: Assume TX side gives B1UL output and RX is receiving B1DL/B3DL and B7DL. What parameters will you investigate? Q: Why does a device has nonlinearity? Q:worst return loss possible? Q: how would you match two points in smith chart? Which one would you choose among 4 types matching? Answer: first I will ask what BW is needed? Q: why do we want our system to be linear? What is intermod? How much intermod will increase with 1 dB increase in Pin? Channel leakage Q: How will you model non-linearity. You don’t have any data. Where does it come from? Q: how will you find IIP3? Q: how will you find noise floor of Spectrum Analyzer? Q: why do we see saw tooth noise floor at very low noise floor in Spectrum Analyzer? Q: how does line impedance change if you make it wider? How ideal line impedance can be expressed in terms of lumped model? Q: How does the wave travel in microstrip line? Which gnd do we want closer to coplanar microstrip line – gnd below the trace or the gnd on the same plane? Q: how will constellation diagram change if we 1. increase gain in I component. 2. Introduce Phase noise.
      Answer question
      2