I applied through a staffing agency. I interviewed at Technosoft Engineering (Pune) in May 2026
Interview
I was contacted by a recruitment agency and they scheduled the first round. This role required me to write Device Driver code for SoCs and MCUs for the client - MIPS. The interviewer joined 15 minutes late. He apologized for it, then proceeded with his introduction, the company's introduction, then asked me to introduce myself and give a brief summary of technical work I have done. Then he started with the interview.
He asked me to solve this question:
//Big Endian / Little Endian format example
//Start byte address - 0x0100
//Data(int) - 0xabcdef01
//store in Little endian format and print the data.,
questions related to SPI, I2C, their differences, if they can have multiple masters, etc. Why and why not I2C and SPI have multiple masters? What is the maximum number of slave devices in SPI and I2C? What is the speed difference between them and which is faster?
I applied through university. The process took 4 weeks. I interviewed at Technosoft Engineering (Pune) in Dec 2025
Interview
Company shortlisted students by cgpa and resume. After they call for interview.
They ask to come for interview at office.
There is only one technical round as it is internship.
I applied online. The process took 1 day. I interviewed at Technosoft Engineering (Thāne) in Sep 2025
Interview
The full-day schedule includes three stages:
1. written test which have calculation base
A software proficiency test..which a one model is given for 3d drawing
A technical interview which have pure in manufacturing process.
These three rounds will be completed on the same day.