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      TE Connectivity

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      Business Development Manager Interview

      Dec 23, 2016
      Anonymous employee
      Shanghai, Shanghai
      Accepted offer
      Positive experience
      Average interview

      Application

      I applied through a recruiter. The process took 2 months. I interviewed at TE Connectivity (Shanghai, Shanghai) in Jul 2016

      Interview

      7 rounds interview. Each round of the interview is not tough but too many rounds of interview which took me 2 months to finish them all. very time consuming and torture in mind. - 1st round with corporate HR for touching base and background sharing - 2nd round with BU HR for more specific job related questions. some very straight forward questions - 3rd round with line manager. one hour interview. line manager made detail introduction about the job function and his expectation. I sensed there's no case interview in this round so that catch the opportunity to ask some smart questions. - 4th round with the future colleague located in US. take one hour. half for background review and half hour for case interview. background review is pretty normal and straight forward. case interview is focusing on sizing / go-to-market / business terminology explanation. - 5th round with corporate BU strategy director. nothing very specific but the questions are asked to know how do you deal with cross-functional or cross-department cases - 6th round with JP business head. also attitude interview and go through my background. very interesting chat since the business head has similar background as me so that we touched a lot of discussion of the observation to business decision - 7th round with APAC business head. asking some situational question to pitch my reactions to some business issues. Also some typical questions about why? how? what? to some decision in my career path.

      Interview questions [1]

      Question 1

      which industry are you going to target in India? what's the size of your target market? what's the go-to-market strategy?
      Answer question