I applied through university. The process took 4 weeks. I interviewed at Micron Technology (Boise, ID) in Feb 2015
Interview
I applied for the position of a NAND non volatile product engineer. I went through a campus interview and they seemed to like me so they flew me out to their base in Boise, ID.
The process spanned 5-6 hours divided into three parts. The first was a three person panel interview where I was drilled by both technical and personal questions. This lasted about an hour and a half. They asked things about work ethic, and what difficult situations I found myself in. Micron basically wants to know what kind of person you are and how you respond to things.
The second part they grace you with a lunch break on them. Finally you have another three person panel where they drill you on more technical questions and try to gauge how you think under pressure. After this they give you a tour of the facility, and one of the engineers may take you out to dinner.
Interview questions [1]
Question 1
There are many questions on device physics such as MOSFET theory, how the device works and how changing certain parameters such as dielectric properties changes how the device reacts. They'll also ask you basic logic questions about nands and XOR gates, and possibly have you draw the basic layout of one.
They also throw some curveballs at you that pertain to their specific manufacturing which is how the floating gate operation works, and how do you utilize it in practice.
python questions, CMOS circuit, inverter graph, basics of semoconductor physics list dictionary and tuple in python and basics of OOP, be ready to talk about your projects and how it related also why you like this specific role
Interview questions [1]
Question 1
how do u solve this digital cmos circuit whats the output?
All communications with HR via emails. Interview Online via zoom. Many managers and higher ups attending the zoom meetings. Total of 4 people. Not much concern on setting up the schedule.
However just be ready, after interview there’s no follow-up, not even a standard rejection email.
Interview questions [1]
Question 1
Previous experience. Motivation to join the company.
There are 3 rounds: first, a round with the Hiring Manager, followed by 2 Technical rounds conducted by the team members. If you pass these, there will be a follow-up HR round.
Interview questions [1]
Question 1
- Basics of memory devices (e.g., DRAM, NAND, etc.)
- SA circuit debugging
- Questions related to your previous work experience
- Fundamentals of semiconductor fabrication
- Basic coding questions
