I DONT KNOW HOW THE INTERVIEW PROCESS IS NOW BUT FOR ME THEY FOLLOWED LIKE, 1.TELIPHONIC ROUND( JUST SHELF INTRODUCTION) 2.APTITUDE ROUND.(it consist both apti as wel as academic related to N/Wking and OS 3. TECHNICAL ROUND, a) C PROGRAMMING TEST b) networking round c) Academic round( on Engineering subjects) d) Group Discussion e) Manager round( about company and some technical questions related to N/W) f) Final HR round - Got cancelled( reason- they selected only two people for HR round and decided to take both) and got offer letter within 5 days after the final round.