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      TMC Bonds

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      Software Engineer(Internship) Interview

      May 8, 2018
      Anonymous employee
      New York, NY
      Accepted offer
      Positive experience
      Average interview

      Application

      I applied through an employee referral. The process took 1 week. I interviewed at TMC Bonds (New York, NY) in May 2018

      Interview

      45 min phone interview that consists mainly technical questions: java, difference between data structures, one LC easy to medium coding. Then got invited to onsite which takes roughly 2 hours, three round: first round has two coding LC easy to medium, second round has java concepts and behavioral, third round was with the HR. Great people, very good experience, and super fast response from the company.

      Interview questions [3]

      Question 1

      Thread questions in Java
      Answer question

      Question 2

      Arraylist v. Linkedlist
      Answer question

      Question 3

      HashMap
      Answer question
      1

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